The study investigated the effect of copper (Cu) doping on the structural, microstructural, and transport properties of neodymium manganite (NdMnO3) thin films. The thin films were prepared using the pulsed laser deposition technique and characterized using various analytical techniques, such as X-ray diffraction, atomic force microscopy, and electrical transport measurements. The results showed that Cu doping altered the crystal structure and microstructure of the thin films, leading to changes in their electrical transport properties. The doped films exhibited enhanced resistivity, attributed to the increased compressive strength resulting from the Cu doping. The study suggests that Cu-doped NdMnO3 thin films may have potential applications in various electronic and sensing devices.